发明名称 METHOD AND APPARATUS FOR DETERMINING SCHEDULING FOR WAFER PROCESSING IN CLUSTER TOOLS WITH INTEGRATED METROLOGY AND DEFECT CONTROL
摘要 <p>Apparatus and concomitant method for performing priority based scheduling of wafer processing within a multiple chamber semiconductor wafer processing system (cluster tool) having at least one metrology chamber. The sequencer assigns priority values to the chambers and stations in a wafer processing system (i.e., a cluster tool plus a factory interface), then moves wafers from chamber to chamber in accordance with the assigned priorities. The sequencer also selects particular wafers for placement into at least one metrology chamber or station.</p>
申请公布号 WO2002059703(A2) 申请公布日期 2002.08.01
申请号 US2002001445 申请日期 2002.01.16
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