Semiconductor device and process for producing the same

摘要

The semiconductor device is in the form of a semiconductor chip formed as a recording head of an ink-jet printer or in the form of a semiconductor wafer having at least two semiconductor chips. The semiconductor chip has at least an ink ejection unit, an integrated circuit composed of a drive circuit for driving the ink ejection unit, bonding pads and a metal film covering at least part of an upper layer of the integrated circuit. The metal film is formed to extend from the integrated circuit to an edge of the semiconductor chip. The semiconductor wafer further has at least one grounding pad being formed of the metal film in a region peripheral to the semiconductor wafer and which is outside the semiconductor chips. The metal film is formed not only to extend from each of the integrated circuits to the edge of each of the semiconductor chips but also in a region between the semiconductor chips and the metal films formed to extend to edges of all the semiconductor chips are interconnected via the region between the semiconductor chips and also connected to the grounding pad.