| 发明名称 |
CURABLE RESIN, CURABLE RESIN MATERIAL, CURABLE FILM, AND INSULATOR |
| 摘要 |
A curable resin (A) which has per molecule at least two crosslinkable functional groups of at least one kind selected from the group consisting of epoxy, (meth)acryloyl, alkenylamino, and alkenyloxy and which before cure has a glass transition temperature of 50 to 150 DEG C and a weight-average molecular weight of 10,000 to 1,000,000, characterized by giving a cured resin having a permittivity of 3.5 or lower. Due to the constitution, the curable resin (A) can give an insulator excellent in thermal shock resistance and dielectric characteristics. |
| 申请公布号 |
WO02059176(A1) |
申请公布日期 |
2002.08.01 |
| 申请号 |
WO2001JP07373 |
申请日期 |
2001.08.28 |
| 申请人 |
SANYO CHEMICAL INDUSTRIES, LTD;SAITO, TAKAO;KON, SIGETO;SATAKE, MUNEKAZU;INOUE, MASAHITO |
发明人 |
SAITO, TAKAO;KON, SIGETO;SATAKE, MUNEKAZU;INOUE, MASAHITO |
| 分类号 |
C08F283/00;C08F287/00;C08F290/04;C08F290/06;C08F290/14;C08G61/06;C08G65/48;C08J5/18;C08L25/14;C08L33/06;C08L35/06;C08L51/00;C08L53/02;C08L63/00;C08L101/02;H01L23/29;H01L23/498;(IPC1-7):C08G59/02;C08F299/00 |
主分类号 |
C08F283/00 |
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