发明名称 Optical device module using integral heat transfer module
摘要 An optical device module using an integral heat transfer module. The heat transfer module has an integrally formed heat source and a temperature sensor for reading temperature. A heat transfer path is simplified in packaging the optical device module, so that the optical device can avoid performance degradation due to nonuniform temperature distribution. The amount power consumption can be reduced and excellent workability can be ensured.
申请公布号 US2002101891(A1) 申请公布日期 2002.08.01
申请号 US20010935825 申请日期 2001.08.23
申请人 KWON OH-DAL;JUNG SUN-TAE;KIM TAE-GYU 发明人 KWON OH-DAL;JUNG SUN-TAE;KIM TAE-GYU
分类号 H01S5/024;G02B7/00;G02B7/02;G02B7/18;G05D23/19;H01L23/38;H01L31/024;(IPC1-7):H01S5/024 主分类号 H01S5/024
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