METHOD FOR SEED LAYER REMOVAL FOR MAGNETIC HEADS

摘要

Electroplated components of magnetic head (100, 150) are fabricated utilizing a seed layer (112, 160) that is susceptible to reactive ion etch removal techniques. The seed layer is comprised of tungsten or titanium is fabricated by sputter deposition, is electrically conductive wherein electroplated components, such as induction coil members (104) and magnetic poles (188), are effectively electroplated into photolithographically created photoresist trenches (108, 180) that are fabricated upon the seed layer. Following the electroplating, the photoresist layer is removed utilizing standard wet chemical process. Utilizing a fluorine species reactive ion etch process the seed layer is removed, significantly, the fluorine RIE process creates a gaseous tungsten or titanium fluoride compound removal product. The problem of seed layer redeposition along the sides of the electroplated components is overcome because the gaseous fluoride compound is not redeposited. Included is an enhanced two part seed layer (138), where the lower part (112) is tungsten, titanium or tantalum, the upper part (140) is composed of material that constitutes the component to be electroplated.