发明名称 Making extended and rounded recess in component for e.g. micro-fluidic flow, employs anisotropic, then isotropic etching through groove-forming mask
摘要 <p>To make a groove- forming recess (3) in the component (1) a mask (6) with opening (7) of appropriate length and width is deposited onto the component (1). Anisotropic, then isotropic etching then take place. An independent claim is included for the component so produced.</p>
申请公布号 DE10104326(A1) 申请公布日期 2002.08.01
申请号 DE2001104326 申请日期 2001.01.24
申请人 SIEMENS AG 发明人 KRETSCHMER, HANS-RICHARD;PETSCH, KATHRIN;STECKENBORN, ARNO
分类号 B81B1/00;(IPC1-7):B81C1/00;H01L21/308;B81C3/00;B81B7/00 主分类号 B81B1/00
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