发明名称 |
Making extended and rounded recess in component for e.g. micro-fluidic flow, employs anisotropic, then isotropic etching through groove-forming mask |
摘要 |
<p>To make a groove- forming recess (3) in the component (1) a mask (6) with opening (7) of appropriate length and width is deposited onto the component (1). Anisotropic, then isotropic etching then take place. An independent claim is included for the component so produced.</p> |
申请公布号 |
DE10104326(A1) |
申请公布日期 |
2002.08.01 |
申请号 |
DE2001104326 |
申请日期 |
2001.01.24 |
申请人 |
SIEMENS AG |
发明人 |
KRETSCHMER, HANS-RICHARD;PETSCH, KATHRIN;STECKENBORN, ARNO |
分类号 |
B81B1/00;(IPC1-7):B81C1/00;H01L21/308;B81C3/00;B81B7/00 |
主分类号 |
B81B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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