| 摘要 |
An apparatus for baking a wafer includes a heating plate for supporting the wafer to be baked, a lifting device for loading and unloading the wafer onto and from the upper surface of the heating plate, and a detector for detecting whether the wafer loaded by the lifting device onto the upper surface of the heating plate extends parallel to the upper surface, i.e., is situated correctly on the heating plate. The detector includes proximity sensors and a controller. The proximity sensors are disposed in or on the heating plate for sensing respective distances from the positions thereof to the wafer and generating signals indicative of whether the wafer is disposed more than a predetermined distance away from the sensors. The controller determines, on the basis of the signals generated by the proximity sensors, whether the baking process should be carried out and controls the baking process once it is initiated.
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