Method and apparatus for a device under test fixture

摘要

A test array is mountable on a test fixture having a set of test fixture sockets. Each of the test fixture sockets is configured to receive a device under test. The test array comprises a first heat sink having a position on the test array that corresponds to a first socket of the set. The test array also comprises a second heat sink having a position on the test array that corresponds to a second socket of the set. The test array further comprises a first set of heat sinks having a first heat sink height and a second set of heat sinks having a second heat sink height such that the difference in the heights compensates for differences in the warpage of the test fixture between the location of the first and second set of heat sinks.