POLYIMIDE RESIN PRECURSOR SOLUTION, LAMINATES FOR ELECTRONIC COMPONENTS MADE BY USING THE SOLUTION AND PROCESS FOR PRODUCTION OF THE LAMINATES

摘要

Laminates for electronic components are produced by applying a polyimide resin precursor solution containing a palladium compound on a polyimide substrate, drying the resulting coating to form a polyimide resin precursor layer, irradiating this layer with ultraviolet rays in the presence of a hydrogen donor to form nuclei for primer plating, forming a metal primer layer by electroless plating, and converting the polyimide resin precursor layer into a polyimide resin layer through imidation by heating either after or before the formation of a surface plating layer. The invention provides laminates for electronic components which are extremely improved in adhesion to metal layers without impairing the characteristics inherent in the substrate and are excellent in insulating properties, and a polyimide resin precursor resin solution to be used in the production of the laminates.