发明名称 |
Method of application of conductive cap-layer in flip-chip, cob, and micro metal bonding |
摘要 |
A method of bonding a bonding element to a metal bonding pad comprises the following steps. A semiconductor structure having an exposed, recessed metal bonding pad within a layer opening is provided. The layer has an upper surface. A conductive cap having a predetermined thickness is formed over the metal bonding pad. A bonding element is bonded to the conductive cap to form an electrical connection with the metal bonding pad.
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申请公布号 |
US2002100794(A1) |
申请公布日期 |
2002.08.01 |
申请号 |
US20020099283 |
申请日期 |
2002.03.15 |
申请人 |
CHARTERED SEMICONDUCTOR MANUFACTURING LTD. |
发明人 |
HO KWOK KEUNG PAUL;CHOOI SIMON;XU YI;ALIYU YAKUB;ZHOU MEI SHENG;SUDIJONO JOHN LEONARD;GUPTA SUBHASH;ROY SUDIPTO RANENDRA |
分类号 |
B23K20/00;H01L23/485;(IPC1-7):B23K31/02 |
主分类号 |
B23K20/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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