Semiconductor apparatus and a semiconductor device mounting method

摘要

A semiconductor apparatus includes a mount pad formed on a substrate and a bump formed on a semiconductor device. A plurality of needle-like or branch-like protrusions is formed on at least one of the mount pad and the bump. The plurality of protrusions of one of the mount pad and the bump engages with the other. The plurality of protrusions protrudes in directions crossing each other, or protrudes to random directions.