| 发明名称 |
Method for fabricating a multilayer ceramic substrate |
| 摘要 |
A first conductive pattern (3) is transfer-printed on a ceramic substrate (2) using an intaglio plate made of a flexible resin, and a first insulation layer (21) is formed thereon, and a second conductive pattern (4) is formed on it. The two conductive patterns (3, 4) are coupled by means of a via (11).
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| 申请公布号 |
US2002100966(A1) |
申请公布日期 |
2002.08.01 |
| 申请号 |
US20020074792 |
申请日期 |
2002.02.12 |
| 申请人 |
HAYAMA MASAAKI;MOURI NOBORU;MATSUNAGA HAYAMI |
发明人 |
HAYAMA MASAAKI;MOURI NOBORU;MATSUNAGA HAYAMI |
| 分类号 |
H01L21/48;H01L21/56;H01L23/12;H05K1/03;H05K1/09;H05K3/12;H05K3/20;H05K3/38;H05K3/40;H05K3/46;(IPC1-7):H01L21/44;H01L23/053 |
主分类号 |
H01L21/48 |
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