| 摘要 |
PURPOSE: An image recognition method for preventing a double bonding is provided to be capable of preventing the defect of a chip. CONSTITUTION: Teaching images of a chip area are evaluated before and after a wire bonding process, then memorized in an image recognition system(22). An image of a standby chip in a bonding area is evaluated. By comparing the teaching images of the chip area with the image of the standby chip, a double bonding of a lead frame(21) is prevented. When the standby chip image is close to the teaching image before the wire bonding process, the standby chip is carried out by the wire bonding process. When the standby chip image is close to the other teaching image after the wire bonding process, the standby chip is regarded as a bonding die, so that the wire bonding process is stopped. |
