发明名称 |
Cleaning method and solution for cleaning a wafer in a single wafer process |
摘要 |
The present invention is a novel cleaning method and a solution for use in a single wafer cleaning process. According to the present invention the cleaning solution comprises ammonium hydroxide (NH4OH), hydrogen peroxide (H2O2), water (H2O) and a chelating agent. In an embodiment of the present invention the cleaning solution also contains a surfactant. And still yet another embodiment of the present invention the cleaning solution also comprises a dissolved gas such as H2. In a particular embodiment of the present invention, this solution is used by spraying or dispensing it on a spinning wafer.
|
申请公布号 |
US2002102852(A1) |
申请公布日期 |
2002.08.01 |
申请号 |
US20010891730 |
申请日期 |
2001.06.25 |
申请人 |
VERHAVERBEKE STEVEN;TRUMAN J. KELLY |
发明人 |
VERHAVERBEKE STEVEN;TRUMAN J. KELLY |
分类号 |
C11D1/29;C11D1/72;C11D3/02;C11D3/04;C11D3/30;C11D3/32;C11D3/33;C11D3/39;C11D7/06;C11D7/18;C11D7/26;C11D7/32;C11D11/00;H01L21/00;H01L21/304;H01L21/306;(IPC1-7):H01L21/302;H01L21/461 |
主分类号 |
C11D1/29 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|