APPARATUS AND METHOD OF INSPECTING SEMICONDUCTOR WAFER

摘要

An apparatus and method of inspecting a removal state of a photoresist film coated on an edge portion of the semiconductor wafer in real time. The apparatus comprises a wafer supporting table, a semiconductor wafer horizontally mounted on the wafer supporting table, and at least one photographing unit, spaced apart from an edge of said semiconductor wafer, for photographing the edge of the wafer.