发明名称 Sputtered insulating layer for wordline stacks
摘要 Insulating material is deposited onto a gate dielectric surface separating two wordline stacks, the method comprising the steps of: A. Forming at least two adjacent wordline stacks over a common gate dielectric, the stacks spaced apart from one another thereby forming an open surface on the gate dielectric between the stacks; and B. Depositing by sputtering the insulating material onto the open surface of the gate dielectric separating the two wordline stacks.
申请公布号 US2002102863(A1) 申请公布日期 2002.08.01
申请号 US20020100397 申请日期 2002.03.18
申请人 MICRON TECHNOLOGY, INC. 发明人 BEAMAN KEVIN L.
分类号 H01L21/60;H01L21/768;H01L21/8242;(IPC1-7):H01L21/31 主分类号 H01L21/60
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