CONNECTOR MOLDING METHOD AND SHIELDED WAFERIZED CONNECTOR MADE THEREFROM

摘要

A high speed, high density electrical connector. The connector is assembled from wafers. Each wafer is formed by molding a first dielectric housing over a shield plate. Signal contacts are inserted into the first dielectric housing and a second housing is overmolded on the first housing. Features are employ ed to lock the first and second housings together with the shield plate to provide a mechanically robust subassembly. The connector as formed has a goo d electrical properties, including precise impedance control and low cross tal k.