| 摘要 |
PURPOSE: To reduce the terminal pitch when packaging a plurality of semiconductor chips 14 and 18 in a semiconductor device in TCP structure. CONSTITUTION: An Au bump 16 for ILB and an Au bump 17 for a semiconductor chip 18 are formed at the semiconductor chip 14 that is bonded to an inner lead 2c, and the semiconductor chip 18 is mounted on a tape 13 via the semiconductor chip 14. As a result, a relatively hard gold bump is less deformed due to junction as compared with a relatively soft solder bump. For example, the terminal pitch can be reduced to approximately 45 μm, and 450 output terminals or more can be obtained in approximately 20 mm chip length. |
