| 摘要 |
PURPOSE:To manufacture a highly reliable and highly dense wiring board efficiently by charging the through hole of an inner layer circuit board with the mixture of metal or metallic particles and thermosetting resin or the mixture of inorganic particles and thermosetting resin. CONSTITUTION:A ground layer 1, a power supply layer 2, and a signal layer 3 are formed by etched foil method, or the like, using a laminate lined with metallic foils, and then those are united through prepregs 7 by pressurization and heating. Next, after boring, a through hole 4 is formed by electric plating or electroless plating. Next, a resist, which has heat resistance, is formed at the surface of this inner layer circuit, and fused metal 10 is filled up in the through hole. As this metal, solder, which has Sn and Pb for its main ingredients, can be used. Furthermore, the mixture where particles such as copper, nickel, stainless, aluminum, etc. are added to thermosetting resin such as epoxy, etc., or the mixture where inorgainc particles such as glass SiO2, alumina, etc., are added to thermosetting resin may be charged in the through hole 4. |
