发明名称 VACUUM DEPOSITION METHOD AND VACUUM DEPOSITION DEVICE
摘要 PROBLEM TO BE SOLVED: To realize both forming a high quality metal thin film at a low cost and reducing thermal damage to a vacuum deposition device. SOLUTION: In a vacuum deposition method comprising melting and evaporating a raw material accommodated in a crucible 4 by a heating means 6 in a vacuum chamber and forming a film on a substrate 2, plural rods of the raw material 7, connected to each other, are successively delivered in the direction of the crucible 4 at a raw material supplying section 8 and then the rods of the raw material 7 are successively heated and melted by the heating means 6 from the direction of the crucible 4 and further the melted raw material is supplied to the crucible 4.
申请公布号 JP2002212706(A) 申请公布日期 2002.07.31
申请号 JP20010002858 申请日期 2001.01.10
申请人 SONY CORP 发明人 HARIMA TATSUYA
分类号 C23C14/24;G11B5/85;(IPC1-7):C23C14/24 主分类号 C23C14/24
代理机构 代理人
主权项
地址