发明名称 MANUFACTURING METHOD FOR PAPER CARRIER TAPE
摘要 PROBLEM TO BE SOLVED: To provide a paper carrier tape manufacturing method in which a chip accommodation recess is formed with excellent accuracy, a part of a bottom part of the chip accommodation recess has appropriate strength against protrusion of a push-out pin, and the chip accommodation recess is machined so as not to have any hole in the bottom part thereof. SOLUTION: In a first step, a through hole 2 is made in a paper carrier tape base material 1a, in a second step, a punch 5 is pressed against the through hole 2 to form the chip accommodation recess 3 over the through hole 2 in the paper carrier tape base material 1a, and the through hole 2 is closed by a part of the paper carrier tape base material 1a. Thus, the paper carrier tape 1 is manufactured. Since the paper carrier tape 1 is manufactured via the first and second steps, the chip accommodation recess 3 is formed with excellent accuracy, and no hole is made in the bottom part of the chip accommodation recess 3, but it is easily opened.
申请公布号 JP2002211507(A) 申请公布日期 2002.07.31
申请号 JP20010014771 申请日期 2001.01.23
申请人 TOKYO WELD CO LTD 发明人 CHIBA MINORU;OKAMURA MATSUO;SAITO AKIRA;YOSHIHARA TAKAO
分类号 B65D73/02;B65B15/04;B65D85/86;H05K3/04;(IPC1-7):B65B15/04 主分类号 B65D73/02
代理机构 代理人
主权项
地址