发明名称 Crosslinkable polymer material of low relative permittivity, and films, substrates and electronic units formed of it
摘要 <p>Disclosed is a polymer material of low relative permittivity obtained through copolymerization of a monomer composition that contains, as monomers, a fumaric diester and an epoxy group-having (meth)acrylate. The polymer material bonds or adheres well to metal conductor layers, and, after crosslinked, it is patternable. In addition, it has good electric properties of low relative permittivity, low dielectric loss tangent and good electric insulation, and has good heat resistance.</p>
申请公布号 EP1227115(A2) 申请公布日期 2002.07.31
申请号 EP20020001609 申请日期 2002.01.23
申请人 TDK CORPORATION;DAI-ICHI KOGYO SEIYAKU CO., LTD. 发明人 ASAMI, SHIGERU;YAMADA, TOSHIAKI;SUGAHARA, TERUAKI;HOTTA, HIROSHI
分类号 C08F222/14;C08J5/18;C08F220/32;C08F222/10;H01B3/44;H01L23/14;H05K1/03;(IPC1-7):C08F222/14 主分类号 C08F222/14
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