| 摘要 |
PROBLEM TO BE SOLVED: To provide a handler system for cutting semiconductor package devices capable of efficiently producing the semiconductor package devices. SOLUTION: The handler system for cutting is provided with a package transfer device 50, a package mounting device 60, a package pickup transfer device 70, a visual inspecting means 90, a package tray mounting device 80, etc. Packages formed by cutting a strip by a cutting device are cleaned, dried, and then mounted to a package mounting device 60 by the package transfer device 50. The mounted packages are sucked by the package pickup transfer device 70, and their quality is inspected by the visual inspecting means 90. The packages subjected to quality inspection are classified by the package pickup transfer device 70 quality level by quality level and individually mounted to a plurality of trays of the package tray mounting device 80.
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