| 摘要 |
PROBLEM TO BE SOLVED: To prepare a copper foil for a printed circuit board which is soluble in alkali etching and all other etching and has excellent chemical resistance and heat resistance. SOLUTION: The copper foil for a printed circuit board has an alloy layer consisting of cobalt-nickel-tungsten at least on one side of the foil and further has a chromate film on the alloy layer depending on the case. The manufacturing method has a step for subjecting the copper foil to cathodic electrolysis in an electrolyte solution containing cobalt, nickel and tungsten to form the cobalt-nickel-tungsten layer and, as the case may be, a subsequent step for providing the chromate film on the layer containing hexavalent chromium.
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