发明名称 THERMOSETTING RESIN COMPOSITION, TRANSFER PRINTING MATERIAL, AND METHOD FOR FORMING INTERLAYER INSULATION FILM
摘要 <p>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition excellent in resistance to heat or chemicals, storage stability, and high-temperature reactivity, a transfer printing material using the same, and a method for forming an interlayer insulation film. SOLUTION: This resin composition contains, based on the total solid content, 1 mass%-100 mass% copolymer which is obtained from a monomer mixture containing 5-80 mol% polymerizable monomer represented by the formula I (wherein R1 is H or methyl; and X is a halogen atom, a hydroxyl group, or an optionally substituted alkoxy, aryloxy, alkylcarbonyloxy, arylcarbonyloxy, alkoxycarbonyloxy, aryloxycarbonyloxy, alkylsulfonyloxy, or arylsulfonyloxy group) and 5-80 mol% carboxyl-group-containing monomer.</p>
申请公布号 JP2002212236(A) 申请公布日期 2002.07.31
申请号 JP20010007879 申请日期 2001.01.16
申请人 FUJI PHOTO FILM CO LTD 发明人 IWASAKI MASAYUKI;WAKATA YUICHI;YAMAMOTO MIZUKI
分类号 G02F1/1333;C08F220/28;C08L101/02;G02F1/1368;(IPC1-7):C08F220/28;G02F1/133;G02F1/136 主分类号 G02F1/1333
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