| 摘要 |
Micro-element package comprises a lower substrate 1 in which can be embedded a micro-element chip 2, for example a fluidic micro-sensor or a micro-electronic component, an upper substrate 5 and a gasket 10 intermediate the substrates characterised in that one of said substrates includes two or more protruding pillars 8,9 and the other of said substrates includes a number of recesses 3,4 corresponding to the number of pillars and into which said pillars can locate, e.g. as a snap-fit, so as to releasably hold said substrates together. The gasket 10 may include an embedded O-ring 13 which seals a cavity housing the chip 2 and in communication with fluid ports 6,7. The pillars 8,9 and/or gasket 10 may include conductive paths connected to the chip 2. A multi-sensor module can be formed by stacking substrates. Application to the environmental and medical fields is envisaged. |
