| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition which is used for sealing semiconductors and can extend a cycle for cleaning a mold without deteriorating a mold release property from the mold. SOLUTION: This epoxy resin composition for sealing semiconductors contains an epoxy resin, a curing agent, a mold release agent, and an inorganic filler as essential components. The mold release agent is selected from compounds represented by the following formulas (1) and (2): CH3-(CH2)n-(OC3H6)x-(OC2H4)y- OH...(1), CH3-(CH2)n-(OC2H4)y-(OC3H6)x-OH...(2) [(x), (y) and (n) are each an integer of >=1], and is contained in an amount of 0.01 to 2.0 wt.% based on the total amount of the epoxy resin composition for sealing semiconductors. The inorganic filler is selected from crystalline silica and molten silica. |
