发明名称 COMPOSITE PLATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a composite plating apparatus in which a homogeneous eutectoid of fine particles, such as graphite, can be formed by a prescribed amount inside the metal plating film of a material to be plated when composite plating of a large number of articles to be plated is carried out with a rotating barrel plating apparatus. SOLUTION: The composite plating apparatus is equipped with a metal plating tank 31 in which a plating liquid is stored, a revolution barrel 40 which is submerged in this metal plating tank 31 and made rotatable in a state it is accommodating a material to be plated 41, and a plating liquid replenishment pipeline 45 in which a plating liquid 32 in the metal plating tank 31 is circulated to a plating liquid replenishing device, or the like. A fuel injecting nozzle 46 which injects a replenishment plating liquid to a part of the plating liquid replenishment pipeline 45 is provided, and the replenishment plating liquid is injected into the inside of the revolution barrel 40 with this fuel injecting nozzle 46.
申请公布号 JP2002212791(A) 申请公布日期 2002.07.31
申请号 JP20010012147 申请日期 2001.01.19
申请人 MITSUBISHI ELECTRIC CORP 发明人 ITO HITOSHI;MATSUMURA KATSUSHI;HASHIMOTO TAKAYUKI;KITAMURA SANEYASU
分类号 C25D15/02;C25D17/20;(IPC1-7):C25D15/02 主分类号 C25D15/02
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