Shape of bonding pad of semiconductor device bonded by wire bonding method.

摘要

A semiconductor chip (100) is die-bonded to a bed (101) of a lead frame. Bonding pads (102) are formed on the semiconductor chip (100) along its periphery. The bonding pads (102) have at least one obtuse-angle corner portion of corner portions facing a nearest side of the chip (100). Each of the bonding pads (102) is bonded to an inner lead portion (106) of the lead frame by a bonding wire (104).