ADHESIVE MEMBER AND METHOD FOR MANUFACTURING THE SAME, AND SUBSTRATE FOR MOUNTING SEMICONDUCTOR COMPRISING THE ADHESIVE MEMBER AND SEMICONDUCTOR DEVICE USING THE SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide an adhesive member, for mounting a semiconductor chip on a substrate, capable of securing rigidity and preventing warpage when it is stuck on the substrate by making the adhesive member have a multilayered structure and have adhesive on both the sides of a rigid substrate, and a method for manufacturing the same. SOLUTION: The adhesive member has a multilayered structure, and it has a thermosetting resin-made adhesive layers B and C on both the sides of a rigid base material A. The ratio between the thickness of the base material A and the total thickness of the adhesive layers B and C satisfies the following relation: (B+C)/A=0.5-6.0.