| 摘要 |
PROBLEM TO BE SOLVED: To provide a prepreg which is used for a printed circuit board, has flame retardancy without using a halogen, has high insulating characteristics for a long period, has excellent substrate soldering heat resistance, and corresponds to environmental problems, and to provide a metal clad laminate using the same. SOLUTION: This prepreg of stage B for a printed circuit board is obtained by impregnating a glass woven fabric with a thermosetting resin varnish and heating and drying the impregnated glass woven fabric. The thermosetting resin varnish comprises (a) a non-halogenated epoxy resin having at least two epoxy groups in the molecule, (b) a phenol compound-formaldehyde polycondensate, and (c) a curing accelerator, and (d) highly pure aluminum hydroxide as essential components, contains (d) the highly pure aluminum hydroxide in an amount of 50 to 150 wt.% based on the organic resin solid content in the varnish, and does substantially not contain a halogen element.
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