发明名称 METAL MASK FOR SPUTTERING
摘要 PROBLEM TO BE SOLVED: To provide a metal mask for sputtering which does not flaw a black matrix and coloring pixels when aligning the metal mask for sputtering to a glass substrate formed with the black matrix and coloring pixels and superposing the metal mask thereon and which does not give rise to abnormal discharge right after sputtering and consequently does not yield defective articles. SOLUTION: The metal mask 10 for sputtering which forms transparent conductive films in superposition on the glass substrate is provided with projecting parts 13 coming into contact with the glass substrate by using a resin in regions exclusive of its apertures 11.
申请公布号 JP2002212721(A) 申请公布日期 2002.07.31
申请号 JP20010002324 申请日期 2001.01.10
申请人 TOPPAN PRINTING CO LTD 发明人 NAKAMURA ATSUTAKA
分类号 C23C14/34;C23C14/50;H01L21/203;(IPC1-7):C23C14/34 主分类号 C23C14/34
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