发明名称 POLYESTER RESIN COMPOSITION FOR HEAT-SHRINKABLE FILM, AND HEAT-SHRINKABLE POLYESTER FILM
摘要 PROBLEM TO BE SOLVED: To develop a heat-shrinkable polyester film which is good at shrinkability and causes no cracks by impact after the warming. SOLUTION: The resin composition for heat-shrinkable films and the film thereof contains 10-70 wt.% of (A) a polyester resin having the main repeating unit of a butylenes terephthalate unit and containing 1-30 wt.% of a polyoxytetramethylene glycol and also containing 3-30 mole % of an aromatic dicarboxylic acid component except terephthalic acid; and 30-90 wt.% of (B) a polyester resin having the main repeating unit of an ethylene terephthalate unit and containing at least one kind of a compound from the group consisting of isophthalic acid, cyclohexane dimethanol and neopentyl glycol in the sum total of 10-50 mole % (isophthalic acid is of mole % in the all acidic components, and cyclohexane dimethanol and neopentyl glycol are of mole % in the all glycolic components) and also having such a glass transition temperature of 50-10 deg.C, for this resin (B) subjected to the heat treatment for 5 minutes at 280 deg.C in nitrogen and to a rapid cooling, as measured by a differential scanning calorimeter at a programming rate of 10 deg.C/minute.
申请公布号 JP2002212405(A) 申请公布日期 2002.07.31
申请号 JP20010012373 申请日期 2001.01.19
申请人 MITSUBISHI RAYON CO LTD 发明人 TANAKA SEISUKE;KIHARA HIDEKI;YOSHIDA JUN
分类号 B65D65/02;B29C61/06;C08J5/18;C08L67/02;(IPC1-7):C08L67/02 主分类号 B65D65/02
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