ELECTROLESS NICKEL PLATING METHOD TO OBJECT TO BE PLATED WHICH HAS BLIND HOLE

摘要

PROBLEM TO BE SOLVED: To provide an electroless nickel plating method which is capable of forming sufficient electroless nickel plating layers even within the blind holes of an object to be plated which has the blind holes. SOLUTION: This method performs electroless nickel plating by immersing the object to be plated which has the blind holes into an electroless nickel plating liquid of a first stage and filling the blind holes with the electroless nickel plating liquid, then immersing the object to be plated in an electroless nickel plating liquid of a second stage in the state that the electroless nickel plating liquid remains in the blind holes, in which the electroless nickel plating liquid of the first stage contains a nickel compound at >=0.15 mol/l and a pH buffering agent at >=0.25 mol/l.