AN ARRAY OF CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER ELEMENTS WITH THROUGH WAFER VIA CONNECTIONS
摘要
There is described a cMUT array with transducer elements which include a plurality of cells with membranes formed on one surface of a wafer. Voltages applied between said spaced electrodes drive said membranes. The voltages applied to said electrodes are applied from the opposite surface of the wafer through the wafer and through vias formed in the wafer.
申请公布号
EP1225984(A1)
申请公布日期
2002.07.31
申请号
EP20000965529
申请日期
2000.09.29
申请人
THE BOARD OF TRUSTEES OFTHE LELAND STANFORD JUNIOR UNIVERSITY