发明名称 PROCESS FOR FORMING PASSIVATED FILM
摘要 <p>A process for forming a passivated film which is far reduced in the amount of gas discharge and can desorb an adsorbed gas more readily, which process comprises heating a stainless steel member with a surface roughness, Rmax, of 1.0 νm or less in an atmosphere of a mixture comprising oxygen gas and an inert gas and having a dew point of -95 °C or below, an impurity concentration of 10 ppb or less and an oxygen content of 5 ppm to 25 vol % at 300 to 420 °C.</p>
申请公布号 WO1992014858(P1) 申请公布日期 1992.09.03
申请号 JP1992000160 申请日期 1992.02.18
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