| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which does not require to apply a can even under vacuum and reduces the releasing amount of an organic gas, and a vacuum device using this composition. SOLUTION: The thermosetting resin composition has an epoxy resin as the main agent and comprises at least one of a curing agent and a catalyst in addition to the epoxy resin, the content of low-molecular organic substances having a molecular weight of <=400 being rendered <=10,000, preferably <=1,000. In order to remove the low-molecular organic substances, the composition is subjected to heat treatment or vacuum treatment or uses a specified polyaddition type curing agent or a specified catalyst or these methods are combinedly used. The polyaddition type curing agent is a primary or secondary amine, an acid anhydride, a phenol novolak or a polymercaptan, and the catalyst is an imidazole or of the cationic polymerization type.
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