| 摘要 |
PROBLEM TO BE SOLVED: To provide a film deposition apparatus which can enhance the adhesion between a substrate and a deposited film and which can prevent electrostatic breakdown due to electrostatic charge. SOLUTION: To a substrate 41 which is to be irradiated with a plasma beam, positive pulse bias voltage is applied periodically while applying negative dc bias voltage with a bias voltage applying apparatus 46. The substrate 41 is positively charged when positive carbon ions are deposited. However, when the electrons in the plasma are drawn into the substrate 41 by application of the positive pulse bias voltage, the electrostatic charge state is more or less neutralized. Consequently, the electrostatic breakdown by the electrostatic charge can be prevented. Since the negative dc bias voltage is applied whenever the pulse bias voltage is absent, a thin film with sufficient adhesion is deposited on the substrate 41.
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