| 发明名称 |
Electroforming apparatus |
| 摘要 |
An electroforming apparatus comprises a container unit for storing a plating solution, a cathode part placed in the container unit and for holding an object to-be-plated and an anode part placed in the container unit face-to-face with the cathode part, wherein a current-conductive opening of the anode part is formed to have an area larger than that of a current-conductive opening of the cathode part. |
| 申请公布号 |
GB2365024(B) |
申请公布日期 |
2002.07.31 |
| 申请号 |
GB20010014657 |
申请日期 |
2001.06.15 |
| 申请人 |
* SONY CORPORATION;* SONY CORPORATION |
发明人 |
EIJI * SAITO;MASATOSHI * SUZUKI;MINORU * TAZOE;MAKOTO * ITO;YUJI * SEGAWA;YUJI * SEGAWA;MAKOTO * ITO;MINORU * TAZOE;MASATOSHI * SUZUKI;EIJI * SAITO |
| 分类号 |
C25D1/00;C25D1/10;G11B7/26 |
主分类号 |
C25D1/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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