| 摘要 |
PROBLEM TO BE SOLVED: To shorten the inspection time of the solid-state image pickup element formed on the surface of a wafer. SOLUTION: Two solid-state image pickup element 2a and 2b arranged in close vicinity of the surface of a wafer 1 are irradiated with inspection lights respectively having uniform luminous intensities from the ends 14a and 14b divided into two of an optical fiber. Shutters 16a and 16b are provided in opposed relation to the ends 14a and 14b of the optical fiber, and the solid-state image pickup elements 2a and 2b are separately irradiated with inspection lights by controlling the on-off operation of the shutters 16a and 16b to be inspected.
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