| 摘要 |
PROBLEM TO BE SOLVED: To obtain a bottom cover tape excellent in adhesive properties with respect to a carrier tape, also favorable for antistatic properties, and excellent in antisticking properties and anticorrosive properties for chip components. SOLUTION: The bottom cover tape for an electronic component carrier has a support base layer and an adhesive layer containing 1-50 pts.wt. of an alicyclic saturated hydrocarbon resin and 0.1-20 pts.wt. of an amphoteric surfactant and/or a nonionic surfactant, not including halogen and/or sulfur, per 100 pts.wt. of a base polymer. It is preferable that the thickness of the adhesive layer is 5-50μm, that the softening point of the adhesive layer is 60-170 deg.C, and that the surface resistivity of the adhesive layer is 108-1013Ω/(square). Further, the surface roughness of the adhesive layer may be 0.1-20μm, and the friction-charged electrostatic potential thereof may be at most 3,000 V.
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