发明名称 MOUNTING PACKAGE
摘要 PROBLEM TO BE SOLVED: To mount a sensor chip on a package for detecting the fingerprint shape of a finger by detecting an electrostatic capacity so as to protect the chip from being damaged by static electricity. SOLUTION: A connecting member 108 comprising a conducive material such as metal for connecting a grounding pin 103b to a cover 106 is provided in a condition penetrated with a frame member 102b.
申请公布号 JP2002213911(A) 申请公布日期 2002.07.31
申请号 JP20010013095 申请日期 2001.01.22
申请人 NIPPON TELEGR & TELEPH CORP <NTT> 发明人 MACHIDA KATSUYUKI;KURAKI OKU;SHIGEMATSU TOMOSHI;MORIMURA HIROKI;UNNO HIDEYUKI
分类号 G01B7/34;G06K9/00;G06T1/00;(IPC1-7):G01B7/34 主分类号 G01B7/34
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