发明名称 |
MOUNTING PACKAGE |
摘要 |
PROBLEM TO BE SOLVED: To mount a sensor chip on a package for detecting the fingerprint shape of a finger by detecting an electrostatic capacity so as to protect the chip from being damaged by static electricity. SOLUTION: A connecting member 108 comprising a conducive material such as metal for connecting a grounding pin 103b to a cover 106 is provided in a condition penetrated with a frame member 102b.
|
申请公布号 |
JP2002213911(A) |
申请公布日期 |
2002.07.31 |
申请号 |
JP20010013095 |
申请日期 |
2001.01.22 |
申请人 |
NIPPON TELEGR & TELEPH CORP <NTT> |
发明人 |
MACHIDA KATSUYUKI;KURAKI OKU;SHIGEMATSU TOMOSHI;MORIMURA HIROKI;UNNO HIDEYUKI |
分类号 |
G01B7/34;G06K9/00;G06T1/00;(IPC1-7):G01B7/34 |
主分类号 |
G01B7/34 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|