| 发明名称 |
Process for removing chemical mechanical polishing residual slurry |
| 摘要 |
A process of removing residual slurry resulting from chemical mechanical polishing of a workpiece in which the workpiece is contacted with a composition of a supercritical fluid, said supercritical fluid including supercritical, carbon dioxide and a co-solvent, and a surfactant.
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| 申请公布号 |
US6425956(B1) |
申请公布日期 |
2002.07.30 |
| 申请号 |
US20010755267 |
申请日期 |
2001.01.05 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
COTTE JOHN MICHAEL;DELEHANTY DONALD J.;MCCULLOUGH KENNETH JOHN;MOREAU WAYNE MARTIN;SIMONS JOHN P.;TAFT CHARLES J.;VOLANT RICHARD P. |
| 分类号 |
H01L21/304;B08B7/00;C11D1/00;C11D3/20;C11D3/43;C23G5/00;H01L21/3105;H01L21/321;(IPC1-7):C23G1/02 |
主分类号 |
H01L21/304 |
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