发明名称 Resin composition and injection-molded article
摘要 A resin composition containing:(A) an ethylene-alpha-olefin copolymer having a melt flow rate of from 0.5 to 100 g/10 min, a density of from 860 to 920 kg/m3, and a highest melting peak temperature of from 50° C. to 110° C.;(B) an ethylene homopolymer or ethylene-alpha-olefin copolymer having a melt flow rate of from 0.5 to 100 g/10 min, a density of from 910 to 980 kg/m3, and a highest melting peak temperature of from 110° C. to 135° C.; and(C) a low-density polyethylene having a melt flow rate of from 0.5 to 100 g/10 min, and a swell ratio of from 1.3 to 2.0, provides a molded article superior in mold release properties, flexibility and heat resistance, particularly when used in injection molding.
申请公布号 US6426385(B2) 申请公布日期 2002.07.30
申请号 US20010780486 申请日期 2001.02.12
申请人 SUMITOMO CHEMICAL COMPANY LIMITED 发明人 KOBAYASHI SHIGEICHI
分类号 C08J5/00;B29C45/00;C08L23/06;C08L23/08;(IPC1-7):C08L23/08;B29K45/00;B29K23/00 主分类号 C08J5/00
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