发明名称 Process of forming a thick oxide field effect transistor
摘要 A SOI field effect transistor structure providing ESD protection. The structure has a source, a drain, a body, and a gate. The gate is formed from a thick oxide layer and a metal contact. The gate s formed during the BEOL process. The transistor may by a p-type transistor or an n-type transistor. The transistor may have its drain tied to either the gate, the body, or both the gate and body. When used as a protection device, the drain is tied to a signal pad and the source is tied to a potential reference.
申请公布号 US6426244(B2) 申请公布日期 2002.07.30
申请号 US20010903820 申请日期 2001.07.12
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 HARGROVE MICHAEL J.;PELELLA MARIO M.;VOLDMAN STEVEN H.
分类号 H01L21/8238;H01L21/336;H01L21/822;H01L23/52;H01L23/58;H01L27/02;H01L27/04;H01L27/092;H01L27/12;H01L29/49;H01L29/78;H01L29/786;(IPC1-7):H01L21/00 主分类号 H01L21/8238
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