| 摘要 |
A semiconductor device comprising a semiconductor substrate on which metal bumps having narrowed base portions are bonded and coated on its top surface with a resin covering the base portions of the metal bumps, improving reliability of the bump bonds. Also, a method of production of a semiconductor device including steps of forming metal bumps in a wafer state, coating a resin for protecting a wiring surface of a semiconductor chip in the wafer state and cutting the semiconductor chip from the wafer, wherein the metal bumps have narrowed base portions and are bonded to the wiring surface of the semiconductor chip and the resin is coated covering the base portions of the metal bumps.
|
