发明名称 |
Method and apparatus for applying solder to an element on a substrate |
摘要 |
There is provided a method for applying solder to an element on a surface of a substrate. The method comprises the steps of (a) placing a mold over the surface, where the mold includes a conduit that contains the solder, and (b) heating the solder to a molten state so that the solder flows from the conduit onto the element. The conduit enjoys two degrees of horizontal freedom with respect to the surface such that the conduit becomes substantially aligned with the element when the solder is in the molten state. There is also provided a system for applying solder to an element on a surface of a substrate.
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申请公布号 |
US6425518(B1) |
申请公布日期 |
2002.07.30 |
申请号 |
US20010912845 |
申请日期 |
2001.07.25 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
GRUBER PETER ALFRED;LEI CHON CHEONG |
分类号 |
B23K3/06;H05K3/34;(IPC1-7):B23K31/02 |
主分类号 |
B23K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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