发明名称 DIE COOLING DEVICE FOR MOLDING MACHINE
摘要 PROBLEM TO BE SOLVED: To provide a die cooling device for a molding machine, which has a pipe-holding means to hold a cooling liquid-feeding pipe being separated from a die. SOLUTION: This die cooling device for the molding machine cools the die 5 by feeding a cooling liquid to the die 5 which is fitted in the molding machine main body 1 through the cooling liquid-feeding pipe 8. For such a die cooling device, the cooling liquid-feeding pipe 8 is detachably connected with the die 5 through a joint 10. At the same time, the pipe-holding means 11 to hold the joint 10a of the cooling liquid-feeding pipe 8 which is separated from the die 5 is provided in the vicinity of the die 5. Therefore, even when hands are removed from the cooling liquid-feeding pipe 8 being separated from the die 5 when the die is replaced, the joint 10a of the cooling liquid-feeding pipe 8 is held by the pipe-holding means 11, and the cooling liquid-feeding pipe 8 is prevented from dropping on a floor surface. Thus, the joint 10a is prevented from deforming or being damaged by colliding with the floor surface, and problems such that the joint 10a cannot be connected with the die 5 or the cooling liquid leaks from the joint 10a being connected with the die 5 can be eliminated.
申请公布号 JP2002210796(A) 申请公布日期 2002.07.30
申请号 JP20010015565 申请日期 2001.01.24
申请人 HITACHI TELECOM TECHNOL LTD 发明人 YOSHINARI TAKASHI
分类号 B29C45/73;B29C33/04;(IPC1-7):B29C45/73 主分类号 B29C45/73
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