发明名称 THERMOFORMING MOLD
摘要 PROBLEM TO BE SOLVED: To provide a thermoforming mold capable of high cycle molding and easily producing a high quality molded item generating no defects such as a crack due to molding or the like. SOLUTION: A thermoforming mold is composed of a pair of molds located in an upward and downward direction each having at least an FRP layer and is capable of heating and curing a compound in a cavity by soaking both molds in a heating liquid in a heating liquid vessel wherein the thermoforming mold is equipped with at least one of an air removing means removing air existing in the reverse side of the downward located mold when the molds are input in the heating vessel and a liquid removing means removing the heating liquid staying in the outer portion of the upward located mold when the molds are taken out from the heating vessel. The air removing means is formed of a cylindrical member the base edge of which is connected to a suction pump and the tip edge of which is located in a concave portion formed in the reverse side of the downward located mold. The liquid removing means is formed of an opening portion mounted in a reinforcing plate of the outer surface of the upward located mold and the opening portion makes neighboring blockaded spaces formed by the reinforcing plate communicate with each other.
申请公布号 JP2002210746(A) 申请公布日期 2002.07.30
申请号 JP20010010555 申请日期 2001.01.18
申请人 YAMAHA LIVINGTEC CORP 发明人 SATO HIROSHI;MIZUNO NOBORU
分类号 B29C33/40;B29C33/04;B29C35/04;(IPC1-7):B29C33/40 主分类号 B29C33/40
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