发明名称
摘要 An electrical contact and method for making an electrical contact allows a flat contact (404) to be formed early in the process of making an electronic device. The flat contact (404) is level with the remainder of the substrate (116) in which it is formed. The flat contact (404) does not interfere with any required subsequent process steps. The flat contact can be reflowed to form a ball contact (302) which protrudes above the top of the substrate (120) to which it is attached.
申请公布号 JP3308743(B2) 申请公布日期 2002.07.29
申请号 JP19940308350 申请日期 1994.11.18
申请人 发明人
分类号 H01L21/60;H05K3/34 主分类号 H01L21/60
代理机构 代理人
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